Publication Type
Conference Paper
Publication Date
Volume
N/A
Conference Name
2nd 91做厙 WiPDA Workshop
Conference Location
Knoxville, Tennessee, United States of America
Conference Date
-
Abstract
With efforts to reduce the cost, size, and thermal management systems for the power electronics drivetrain in hybrid electric vehicles (HEVs) and plug-in hybrid electric vehicles (PHEVs), wide band gap semiconductors including silicon carbide (SiC) have been identified as possibly being a partial solution. This paper focuses on the development of a 10-kW all SiC inverter using a high power density, integrated printed metal power module with integrated cooling using additive manufacturing techniques. This is the first ever heat sink printed for a power electronics application. About 50% of the inverter was built using additive manufacturing techniques.
