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Publication

Kilovolt Tri-Gate GaN Junction HEMTs with High Thermal Stability

Publication Type
Conference Paper
Book Title
Proceedings of International Symposium on Power Semiconductor Devices and Ics (ISPSD),
Publication Date
Page Numbers
139 to 142
Conference Name
The 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
Conference Location
Nagoya, Japan
Conference Sponsor
Hitachi, Mitsubishi, Infineon, Mirise Technologies
Conference Date
-

The lack of reports on the high-temperature performance of tri-gate GaN power HEMTs has raised serious concern on their competitiveness. This work demonstrates the first normally-off tri-gate GaN HEMT that can block kilovolts at 150 °C and zero gate bias. The key enabling device design is a new type of tri-gate, the junction tri-gate, which comprises p-n junction wrapping around AlGaN/GaN fins in the gate region. At 150 °C, the GaN tri-gate junction HEMT (Tri-JHEMT) retains strong gate control and stable threshold voltage, while the traditional tri-gate metal-insulator-semiconductor (MIS) HEMTs fabricated on the same wafer shows a large threshold voltage shift and inferior capabilities of voltage blocking. These results show the excellent thermal stability of GaN Tri-JHEMTs and their great potentials for power electronics applications.