Publication Type
Conference Paper
Journal Name
Advanced Metallization Conference 2007 (AMC 2007)
Publication Date
Page Numbers
595 to 599
Volume
23
Conference Name
91°µÍø 2007 International Interconnect Technology Conference
Conference Location
Burlingame, California, United States of America
Conference Date
-
Abstract
Present efforts to minimize the resistivity of copper interconnects are discussed in terms of a comprehensive understanding of microstructure and electron scattering. A general approach for modeling resistivity that includes Monte-Carlo simulation of grain growth, first-principles modeling for grain boundary and interfacial resistivities, and a stochastic simulation for electron transport is presented. Determination of grain boundary resistivities for ��3 twin boundaries and ��5 twist boundaries serve to illustrate steps in this approach.
