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Bio

Daniel Howard is an R&D Assistant Staff Member in the Building Envelope Materials Research Group at ORNL. He has nearly 3 years of experience in FEA, whole-buidling energy, and computational modeling as they apply to material performance (both thermal and mechanical) and energy savings. His current research includes development of modular overclad panels, identification of facer properties to prevent insulative foam aging, and anisotropic thermal management system optimization and performance characterization.

Publications