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The technologies provide additively manufactured thermal protection system.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

The QVis Quantum Device Circuit Optimization Module gives users the ability to map a circuit to a specific quantum devices based on the device specifications.

QVis is a visual analytics tool that helps uncover temporal and multivariate variations in noise properties of quantum devices.

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.

The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.

The solution proposed here is a modified carbon-based tile face that is mechanically combined with an insulative backing. The tile face is based on a material architecture to minimize weight and thermal conductivity while maximizing thermal stability.

This technology aims to provide and integrated and oxidation resistant cladding or coating onto carbon-based composites in seconds.