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Researcher
- Corson Cramer
- Steve Bullock
- Greg Larsen
- James Klett
- Trevor Aguirre
- Mingyan Li
- Sam Hollifield
- Vlastimil Kunc
- Ahmed Hassen
- Beth L Armstrong
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- Joseph Olatt
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- Kunal Mondal
- Lilian V Swann
- Luke Koch
- Mahim Mathur
- Mary A Adkisson
- Michael Kirka
- Nadim Hmeidat
- Oscar Martinez
- Sana Elyas
- Steven Guzorek
- T Oesch
- Tomonori Saito
- Tony Beard

Mechanism-Based Biological Inference via Multiplex Networks, AI Agents and Cross-Species Translation
This invention provides a platform that uses AI agents and biological networks to uncover and interpret disease-relevant biological mechanisms.

The technologies provide additively manufactured thermal protection system.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.

Real-time tracking and monitoring of radioactive/nuclear materials during transportation is a critical need to ensure safety and security. Current technologies rely on simple tagging, using sensors attached to transport containers, but they have limitations.

The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.

The solution proposed here is a modified carbon-based tile face that is mechanically combined with an insulative backing. The tile face is based on a material architecture to minimize weight and thermal conductivity while maximizing thermal stability.