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Researcher
- Ali Passian
- Hsuan-Hao Lu
- Joseph Lukens
- Nicholas Peters
- Peeyush Nandwana
- Alex Plotkowski
- Amit Shyam
- Joseph Chapman
- Muneer Alshowkan
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- Blane Fillingim
- Brian Post
- Costas Tsouris
- Gs Jung
- Gyoung Gug Jang
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- Lauren Heinrich
- Pratishtha Shukla
- Radu Custelcean
- Sergiy Kalnaus
- Sudarsanam Babu
- Sudip Seal
- Sumit Bahl
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- Beth L Armstrong
- Brandon Miller
- Brian Williams
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- Claire Marvinney
- Craig A Bridges
- Debangshu Mukherjee
- Emilio Piesciorovsky
- Gary Hahn
- Georgios Polyzos
- Gerry Knapp
- Harper Jordan
- Jaswinder Sharma
- Joel Asiamah
- Joel Dawson
- Jong K Keum
- Jovid Rakhmonov
- Mariam Kiran
- Md Inzamam Ul Haque
- Mina Yoon
- Nageswara Rao
- Nance Ericson
- Nancy Dudney
- Nicholas Richter
- Olga S Ovchinnikova
- Pablo Moriano Salazar
- Ramanan Sankaran
- Rangasayee Kannan
- Raymond Borges Hink
- Ryan Dehoff
- Sheng Dai
- Sunyong Kwon
- Tomas Grejtak
- Varisara Tansakul
- Vimal Ramanuj
- Vivek Sujan
- Wenjun Ge
- Ying Yang
- Yiyu Wang

We developed and incorporated two innovative mPET/Cu and mPET/Al foils as current collectors in LIBs to enhance cell energy density under XFC conditions.

A new nanostructured bainitic steel with accelerated kinetics for bainite formation at 200 C was designed using a coupled CALPHAD, machine learning, and data mining approach.

Polarization drift in quantum networks is a major issue. Fiber transforms a transmitted signal’s polarization differently depending on its environment.

Digital twins (DTs) have emerged as essential tools for monitoring, predicting, and optimizing physical systems by using real-time data.

Simulation cloning is a technique in which dynamically cloned simulations’ state spaces differ from their parent simulation due to intervening events.

Electrochemistry synthesis and characterization testing typically occurs manually at a research facility.

ORNL's fully on-chip CMOS-fabricated integrated photonic circuit can generate polarization or frequency entangled photons for use in quantum communications and networking.

This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.

Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.