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- Corson Cramer
- Steve Bullock
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- James Klett
- Trevor Aguirre
- Adam Willoughby
- Rishi Pillai
- Rob Moore II
- Vlastimil Kunc
- Ahmed Hassen
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- Dustin Gilmer
- Jiheon Jun
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- Marie Romedenne
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- Nadim Hmeidat
- Priyanshi Agrawal
- Sana Elyas
- Steven Guzorek
- Tomonori Saito
- Tony Beard
- Yong Chae Lim
- Zhili Feng

The technologies provide additively manufactured thermal protection system.

A novel method that prevents detachment of an optical fiber from a metal/alloy tube and allows strain measurement up to higher temperatures, about 800 C has been developed. Standard commercial adhesives typically only survive up to about 400 C.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Test facilities to evaluate materials compatibility in hydrogen are abundant for high pressure and low temperature (<100C).

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.

The technologies provide a coating method to produce corrosion resistant and electrically conductive coating layer on metallic bipolar plates for hydrogen fuel cell and hydrogen electrolyzer applications.

Molecular Beam Epitaxy is a traditional technique for the synthesis of thin film materials used in the semiconducting and microelectronics industry. In its essence, the MBE technique heats crucibles filled with ultra-pure atomic elements under ultra high vacuum condition

The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.