Invention Reference Number
A novel integrated 3D half-bridge power module package has been developed to address performance challenges in power electronics. By minimizing parasitic inductance and resistance, the design enables improved electrical performance for wide bandgap devices. This innovation is particularly valuable for applications where size, weight, and efficiency are critical, such as renewable energy systems, electric vehicles, and portable electronics.
Description
This innovative technology introduces a three-dimensional design for half-bridge power modules, incorporating vertically oriented power device chips, a conductive spacer, and high-density ceramic capacitors with low equivalent series inductance (ESL). The stacked configuration achieves the shortest conducting paths and reduces parasitic inductance and resistance within the module. These advancements minimize voltage overshoot and switching losses, significantly enhancing power transfer efficiency and system performance.
The compact and efficient design is ideal for space-constrained environments, delivering a substantial increase in power density. By integrating high-performance components in a compact structure, the module is particularly suited for high-efficiency applications in renewable energy, electric transportation, and industrial power systems.
Applications and Industries
- Industrial power supplies, motor drives, and DC-DC converters
- Fast-charging infrastructure and electric vehicles
- Renewable energy stems (e.g., solar inverters)
Benefits
- Increased power density: Enables compact, lightweight designs for space-limited applications
- Enhanced electrical performance: Reduces parasitic inductance and resistance, leading to improved efficiency and reduced energy losses
- Improved system efficiency: Minimizes heat generation and voltage overshoot, critical for high-efficiency applications
Contact
To learn more about this technology, email partnerships@ornl.gov or call 865-574-1051.
