Invention Reference Number
Efficient thermal management in polymers is essential for developing lightweight, high-strength materials with multifunctional capabilities. Traditional polymer composites reinforced with carbon-based fillers often underperform due to limited heat transfer at the interface between the filler and polymer matrix. This invention addresses that challenge by enhancing interfacial interactions to significantly improve thermal conductivity and mechanical strength in polymer composites. By promoting covalent bonding and optimizing filler alignment, the material architecture enables more effective heat flow. Additionally, the introduction of tailored molecular linkers creates a transitional interphase that minimizes thermal resistance and stiffness mismatch, allowing phonons to move more efficiently across the interface. These advancements yield composites with over 50% improvement in thermal conductivity and more than 85% increase in tensile strength. Beyond thermal and mechanical enhancements, this approach also unlocks thermoelectric functionality by enabling electron transport under a thermal gradient. The result is a versatile, high-performance composite platform capable of simultaneously meeting mechanical, thermal, and electrical demands—ideal for advanced industrial, aerospace, and electronics applications.
Contact:
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