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Researcher
- Corson Cramer
- Steve Bullock
- Rafal Wojda
- Greg Larsen
- James Klett
- Prasad Kandula
- Trevor Aguirre
- Blane Fillingim
- Brian Post
- Lauren Heinrich
- Peeyush Nandwana
- Sudarsanam Babu
- Thomas Feldhausen
- Vandana Rallabandi
- Vlastimil Kunc
- Yousub Lee
- Ahmed Hassen
- Alexander I Wiechert
- Alex Plotkowski
- Beth L Armstrong
- Charlie Cook
- Christopher Fancher
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- Costas Tsouris
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- Debangshu Mukherjee
- Dustin Gilmer
- Gs Jung
- Gyoung Gug Jang
- John Lindahl
- Jordan Wright
- Marcio Magri Kimpara
- Md Inzamam Ul Haque
- Michael Kirka
- Mostak Mohammad
- Nadim Hmeidat
- Olga S Ovchinnikova
- Omer Onar
- Praveen Kumar
- Radu Custelcean
- Ramanan Sankaran
- Sana Elyas
- Shajjad Chowdhury
- Steven Guzorek
- Subho Mukherjee
- Suman Debnath
- Tomonori Saito
- Tony Beard
- Vimal Ramanuj
- Wenjun Ge

Misalignment issues of the PWPT system have been addressed. The intercell power transformer has been introduced in order to improve load sharing of the system during a mismatch of the primary single-phase coil and the secondary multi-phase coils.

The technologies provide additively manufactured thermal protection system.

Among the methods for point source carbon capture, the absorption of CO2 using aqueous amines (namely MEA) from the post-combustion gas stream is currently considered the most promising.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

An ORNL invention proposes using 3D printing to make conductors with space-filling thin-wall cross sections. Space-filling thin-wall profiles will maximize the conductor volume while restricting the path for eddy currents induction.

This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.

Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.