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Researcher
- Amit Shyam
- Alex Plotkowski
- Ryan Dehoff
- Brian Post
- James A Haynes
- Sumit Bahl
- Vincent Paquit
- Adam Stevens
- Akash Jag Prasad
- Alex Roschli
- Alice Perrin
- Andres Marquez Rossy
- Calen Kimmell
- Cameron Adkins
- Canhai Lai
- Christopher Fancher
- Chris Tyler
- Clay Leach
- Costas Tsouris
- Dean T Pierce
- Diana E Hun
- Gerry Knapp
- Gina Accawi
- Gordon Robertson
- Gurneesh Jatana
- Isha Bhandari
- James Haley
- James Parks II
- Jaydeep Karandikar
- Jay Reynolds
- Jeff Brookins
- Jovid Rakhmonov
- Liam White
- Mark M Root
- Michael Borish
- Nicholas Richter
- Peeyush Nandwana
- Peter Wang
- Philip Boudreaux
- Rangasayee Kannan
- Roger G Miller
- Sarah Graham
- Singanallur Venkatakrishnan
- Sudarsanam Babu
- Sunyong Kwon
- Vladimir Orlyanchik
- William Peter
- Ying Yang
- Yukinori Yamamoto
- Zackary Snow

Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

System and method for part porosity monitoring of additively manufactured components using machining
In additive manufacturing, choice of process parameters for a given material and geometry can result in porosities in the build volume, which can result in scrap.

We have been working to adapt background oriented schlieren (BOS) imaging to directly visualize building leakage, which is fast and easy.

The lack of real-time insights into how materials evolve during laser powder bed fusion has limited the adoption by inhibiting part qualification. The developed approach provides key data needed to fabricate born qualified parts.

Sensing of additive manufacturing processes promises to facilitate detailed quality inspection at scales that have seldom been seen in traditional manufacturing processes.