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Researcher
- Corson Cramer
- Steve Bullock
- Vlastimil Kunc
- Alex Plotkowski
- Amit Shyam
- Greg Larsen
- James Klett
- Trevor Aguirre
- Ahmed Hassen
- James A Haynes
- Steven Guzorek
- Sumit Bahl
- Alice Perrin
- Andres Marquez Rossy
- Beth L Armstrong
- Charlie Cook
- Christopher Hershey
- Christopher Ledford
- Craig Blue
- Dan Coughlin
- Daniel Rasmussen
- David J Mitchell
- Dustin Gilmer
- Gerry Knapp
- Jim Tobin
- John Lindahl
- Jordan Wright
- Josh Crabtree
- Jovid Rakhmonov
- Kim Sitzlar
- Merlin Theodore
- Michael Kirka
- Nadim Hmeidat
- Nicholas Richter
- Peeyush Nandwana
- Ryan Dehoff
- Sana Elyas
- Subhabrata Saha
- Sunyong Kwon
- Tomonori Saito
- Tony Beard
- Vipin Kumar
- Ying Yang

Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

The technologies provide additively manufactured thermal protection system.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.

Through the use of splicing methods, joining two different fiber types in the tow stage of the process enables great benefits to the strength of the material change.

The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.