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Researcher
- Ryan Dehoff
- Kyle Kelley
- Rama K Vasudevan
- Michael Kirka
- Sergei V Kalinin
- Vincent Paquit
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- Ahmed Hassen
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- Alice Perrin
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- Patxi Fernandez-Zelaia
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- Philip Bingham
- Rangasayee Kannan
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- Singanallur Venkatakrishnan
- Stephen Jesse
- Steven Randolph
- Sudarsanam Babu
- Vipin Kumar
- Vlastimil Kunc
- William Peter
- Yan-Ru Lin
- Ying Yang
- Yongtao Liu
- Yukinori Yamamoto

The invention introduces a novel, customizable method to create, manipulate, and erase polar topological structures in ferroelectric materials using atomic force microscopy.

High coercive fields prevalent in wurtzite ferroelectrics present a significant challenge, as they hinder efficient polarization switching, which is essential for microelectronic applications.

High strength, oxidation resistant refractory alloys are difficult to fabricate for commercial use in extreme environments.

In manufacturing parts for industry using traditional molds and dies, about 70 percent to 80 percent of the time it takes to create a part is a result of a relatively slow cooling process.

This technology combines 3D printing and compression molding to produce high-strength, low-porosity composite articles.

This invention presents technologies for characterizing physical properties of a sample's surface by combining image processing with machine learning techniques.

This technology is a strategy for decreasing electromagnetic interference and boosting signal fidelity for low signal-to-noise sensors transmitting over long distances in extreme environments, such as nuclear energy generation applications, particularly for particle detection.

Simurgh revolutionizes industrial CT imaging with AI, enhancing speed and accuracy in nondestructive testing for complex parts, reducing costs.

This invention introduces a system for microscopy called pan-sharpening, enabling the generation of images with both full-spatial and full-spectral resolution without needing to capture the entire dataset, significantly reducing data acquisition time.