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Researcher
- Brian Post
- Peter Wang
- Amit Shyam
- Alex Plotkowski
- Andrzej Nycz
- Blane Fillingim
- Chris Masuo
- Peeyush Nandwana
- Sudarsanam Babu
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- Ahmed Hassen
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- Junghoon Chae
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- Mingyan Li
- Ryan Dehoff
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- Sumit Bahl
- Travis Humble
- Yousub Lee
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- Joseph Olatt
- Jovid Rakhmonov
- Kevin Spakes
- Kunal Mondal
- Liam White
- Lilian V Swann
- Luke Koch
- Luke Meyer
- Mahim Mathur
- Mary A Adkisson
- Michael Borish
- Nicholas Richter
- Oscar Martinez
- Rangasayee Kannan
- Ritin Mathews
- Roger G Miller
- Samudra Dasgupta
- Sarah Graham
- Scott Smith
- Steven Guzorek
- Sunyong Kwon
- T Oesch
- Vlastimil Kunc
- William Carter
- William Peter
- Ying Yang
- Yukinori Yamamoto

Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

This manufacturing method uses multifunctional materials distributed volumetrically to generate a stiffness-based architecture, where continuous surfaces can be created from flat, rapidly produced geometries.

The lack of real-time insights into how materials evolve during laser powder bed fusion has limited the adoption by inhibiting part qualification. The developed approach provides key data needed to fabricate born qualified parts.

The QVis Quantum Device Circuit Optimization Module gives users the ability to map a circuit to a specific quantum devices based on the device specifications.

QVis is a visual analytics tool that helps uncover temporal and multivariate variations in noise properties of quantum devices.

A valve solution that prevents cross contamination while allowing for blocking multiple channels at once using only one actuator.

Materials produced via additive manufacturing, or 3D printing, can experience significant residual stress, distortion and cracking, negatively impacting the manufacturing process.

This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.

Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.