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Researcher
- Corson Cramer
- Steve Bullock
- Greg Larsen
- James Klett
- Trevor Aguirre
- Vlastimil Kunc
- Ahmed Hassen
- Beth L Armstrong
- Bruce Moyer
- Charlie Cook
- Christopher Hershey
- Christopher Ledford
- Craig Blue
- Daniel Rasmussen
- Dave Willis
- David J Mitchell
- Debjani Pal
- Dustin Gilmer
- Jeffrey Einkauf
- Jennifer M Pyles
- John Lindahl
- Jordan Wright
- Kuntal De
- Laetitia H Delmau
- Luke Chapman
- Luke Sadergaski
- Michael Kirka
- Nadim Hmeidat
- Sana Elyas
- Steven Guzorek
- Sydney Murray III
- Tomonori Saito
- Tony Beard
- Vasilis Tzoganis
- Vasiliy Morozov
- Yun Liu

We presented a novel apparatus and method for laser beam position detection and pointing stabilization using analog position-sensitive diodes (PSDs).

Ruthenium is recovered from used nuclear fuel in an oxidizing environment by depositing the volatile RuO4 species onto a polymeric substrate.

The technologies provide additively manufactured thermal protection system.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.

High and ultra-high vacuum applications require seals that do not allow leaks. O-rings can break down over time, due to aging and exposure to radiation. Metallic seals can damage sealing surfaces, making replacement of the original seal very difficult.

The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.

The solution proposed here is a modified carbon-based tile face that is mechanically combined with an insulative backing. The tile face is based on a material architecture to minimize weight and thermal conductivity while maximizing thermal stability.